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4 The PCB Magazine • November 2017 This month, we cover the wide-ranging topic of HDI: from the latest technology developments and manu- facturing challenges, to HDI strategies that include de- sign, fabrication, and assembly perspectives. As one of our feature contributors, Happy Holden, says, in North America, there is a growing need for more HDI capa- bility. Find out why in this issue! November 2017 Featured Content HDI: Today, Tomorrow and the Future FEATURES: 35 Years of HDI Fabrication Processes and Obstacles for Implementation by Happy Holden HDI: Today, Tomorrow and the Future by the I-Connect007 Team FEATURE COLUMNS: Moving into Microvias: The Interaction of Materials and Processes, Part 2 by Michael Carano Strategies for High-Density PCBs by Vern Solberg 12 42 28 34 28 34 42 12

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