Design007 Magazine

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• Cover
• Featured Content — High-Density Design
• More Content
• Column — Is HDI Making a Comeback in the U.S.?
• Feature Interview — The HDI Roundtable Experts Discussion
• Short — New Quantum Materials Offer Novel Route to 3D Electronic Devices
• Feature — Three Perspectives on HDI Design and Manufacturing Success
• Short — Carbon Atoms Assemble Themselves on Command
• Feature — The Impact of HDI on PCB Power Distribution
• Short — Graphene Performs Under Pressure
• Feature — HDI PCBs: Make the Right Choice from Design to Volume
• Short — Additive Manufacturing May Hold Key to Transforming Nanomaterials into Multifunctional Devices
• Feature Column — Strategies for High-Density PCBs
• Feature Interview — EDADOC Discusses HDI Design and Manufacturing
• Short — A Powerful Duo
• PCB007 Highlights
• Column — Next-Gen PCBs—Substrate Integrated Waveguides
• MilAero007 Highlights
• Column — Don't Lose Sight of Who You Really Are
• Short — Lightning-Fast Communications
• Column — Heat Transfer and Thermal Conductivity: The Facts
• Short — Highly Flexible Organic Flash Memory for Foldable and Disposable Electronics
• Top Ten Recent Highlights from PCBDesign007
• Career Opportunities Section
• Events Calendar
• Advertiser Index and Masthead
• Back Cover