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58 SMT Magazine • December 2017 THE EFFECT OF AREA SHAPE AND AREA RATIO ON SOLDER PASTE PRINTING PERFORMANCE tions are extended to regard the orientation and shape of the stencil apertures. Additional research has to be done to find proof for the ideas given in this paper. Different types of solder pastes and stencil thicknesses ex- tend the data basis and help to refine the first introduced modeling. This could also lead to nonlinear correlations that have to be includ- ed for more precise calculations. New materials as finer grained solder paste types, stencil tech- nologies and stencil coatings shift the limits for obtaining a well-controlled stencil printing pro- cess. Additionally, new calculations based on fundamental printing tests contribute to under- stand printing behavior of miniaturized struc- tures to achieve a robust solder paste printing performance. SMT References 1. K. Vijay, "Miniaturization—Solder Paste Attributes for Maximizing the Print & Reflow Manufacturing Process Window," IMAPS Eu- rope (Hrsg.): 18 th European Microelectronics and Packaging Conference (EMPC), Brighton, pp. 26–29, 2011. 2. C. Combet and M.-M. Chang, "01005 As- sembly, the AOI route to optimizing yield," Vi TECHNOLOGY, Jul. 2009. 3. R. S. Clouthier, "The Complete Solder Paste Printing Processes," (en), SMT Magazine, vol. 13, pp. 6–8, 1999. 4. C. H. Mangin, "Where quality is lost on SMT boards," Circuit Assembly, no. 2, pp. 63–64, 1991. 5. S. Härter, "Evaluation of the Stencil Print- ing for Highly Miniaturized SMT Components with 03015 mm in Size," in Proceedings of Sur- face Mount Technology Association Interna- tional Conference (SMTAI), Rosemont, Illinois, 2015, pp. 756–764. 6. S. Härter, C. Läntzsch, and J. Franke, "Fun- damental study on a secure printing process us- ing NanoWork stencils for 01005 components," in Proceedings of Surface Mount Technology Association International Conference (SMTAI), Rosemont, Illinois, 2014, pp. 878–884. 7. M. Whitmore, J. D. Schake, and C. Ash- more, "The impact of stencil aperture design for next generation ultra-fine pitch printing," in Proceedings of the 35 th International Elec- tronics Manufacturing Technology Conference, 2012, pp. 1–7. Editor's Note: This article was originally published in the proceedings of SMTA International. Jeff Schake is a senior engineer, Ad- vanced Print Technologies Printing Solutions, of ASM Assembly Systems LLC. Mark Whitmore is the senior man- ager, Advanced Print Technologies Printing Solutions, of ASM Assembly Systems LLC. Stefan Härter (chief engineer)*, Jens Niemann (scientific assistant)*, and Jörg Franke (head of chair) are from the Institute for Factory Automa- tion and Production Systems (FAPS), Friedrich- Alexander-University Erlangen-Nürnberg (FAU). * At the time of writing. At the recent SMTA International conference in Rosemont, Illinois, I-Connect007 Managing Edi- tor Patty Goldman caught up with Ram Wissel, VP of Global Technology at KYZEN, to talk about the latest cleaning challenges, and bringing Industry 4.0 into the world of cleaning in PCB assembly. They also discussed the misconception about "no- clean", the challenges it brings, and how the com- pany is helping customers to address their issues toward no-clean solders and fluxes. Read the full interview here. Cleaning Trends: The Challenges of Miniaturization and Proximity

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