Issue link: https://iconnect007.uberflip.com/i/911509
Minimizes solder beading High ECM performance under low standoff components High print transfer efficiency with low variation Excellent wetting Very low bridging, slump, and solder balling Indium10.1HF Halogen-Free, No-Clean, Pb-Free S O L D E R P A S T E Click our video for more: Contact our engineers today: techsupport@indium.com Learn more: www.indium.com/avoidthevoid/SMTUS ©2017 Indium Corporation Typical Voiding >40% Void Area Indium10.1HF <10% Void Area