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96 SMT Magazine • December 2017 FPGA Design Expert Orbotech is seeking a FPGA Design Expert to join our electronics team, which develops multi-disciplinary systems including vision/la- ser, image processing and electro-optics. What Will Your Job Look Like? • Lead image acquisition and processing activities in the team • Engage in all aspects of FPGA design activity: requirement phase, coding, synthesizing, verification support and LAB bring up • Participate in system definitions for current and next generation products • Collaborate with other teams: SW, algorithm and QA What Do You Need to Succeed? • BSc/MSc in Electrical Engineering from a well-recognized university • Extensive knowledge of VHDL • 5+ years of FPGA development experience (requirement, architecture, RTL coding, simulation, synthesis, timing analysis, P&R, board level integration and verification) • Experience in designing and implementing low-latency, high-throughput FPGA designs utilizing PCIe Gen2/3, Gigabit Ethernet, SERDES, DDR3/4 • Experience in complex FPGA such as Altera Stratix-II and Arria 5&10 devices • Authoring documentation experience such as FPGA specifications and FPGA verification plans Who We Are Virtually every electronic device in the world is produced using Orbotech systems. For over 30 years, Orbotech has been a mar- ket leader in developing cutting-edge inspec- tion, test, repair, and production solutions for the manufacture of the world's most sophisti- cated consumer and industrial electronics. Arlon EMD, located in Rancho Cucamon- ga, California is currently interviewing can- didates for manufacturing and man- agement positions. All interested can- didates should contact Arlon's HR depart- ment at 909-987-9533 or fax resumes to 866-812-5847. Arlon is a major manufacturer of special- ty high performance laminate and prepreg materials for use in a wide variety of PCB (printed circuit board) applications. Arlon specializes in thermoset resin technology including polyimide, high Tg multifunc- tional epoxy, and low loss thermoset lami- nate and prepreg systems. These resin sys- tems are available on a variety of substrates, including woven glass and non-woven ara- mid. Typical applications for these materials include advanced commer cial and military electronics such as avionics, semiconductor testing, heat sink bonding, high density in - terconnect (HDI) and microvia PCBs (i.e., in mobile communication products). Our facility employs state of the art pro- duction equipment engineered to provide cost-effective and flexible manufacturing capacity allowing us to respond quickly to customer requirements while meeting the most stringent quality and tolerance de - mands. Our manufacturing site is ISO 9001: 2008 registered, and through rigorous qual- ity control practices and commitment to continual improvement, we are dedicated to meeting and exceeding our customer's requirements.