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66 The PCB Design Magazine • December 2017 by Joe Fjelstad VERDANT ELECTRONICS The 23 rd annual IEEE International Sympo- sium for Design and Technology in Electronic Packaging (SIITME) was held in Constanta, Ro- mania, October 26-29, 2017. It attracted more than 190 participants from Romania, and 13 other counties. While there might be some who question the suitability of Romania as a venue for such a conference, the country has a long technological history and has produced some top innovators and pioneers in aviation includ- ing Aurel Vlaicu, Traian Vuia, Henri Coanda (who prototyped an early jet aircraft in 1910), and great engineers like Anghel Saligny, and George Constantinescu, a pioneering scientist credited with developing the theory of sonics. The convention was created to bring togeth- er members of the electronic packaging com- munity from near and far to discuss technol- ogy developments and needs. Ongoing efforts by the organizers have been intensified over the last decade in their effort to bring together academia and industry to share knowledge and experiences. The SIITME conference creates a shared environment where students, teachers, and senior researchers present their latest works and interact with industry representatives who highlight the state-of-the-art in the industry. As Professor Dan Pitica of the Technical University of Cluj Napoca, Romania, observed, IEEE's Romanian SIITME Show a Success ARTICLE Figure 1: The oral session opened with a presentation by Jose Sartori. Figure 2: The Industrial Workshop was moderated by Cosmin Moisa and Stefan Techau. Yours truly is shown discussing my disruptive solderless Occam technology.

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