SMT007 Magazine

Minimizes solder beading High ECM performance under low standoff components High print transfer efficiency with low variation Excellent wetting Very low bridging, slump, and solder balling Indium10.1HF Halogen-Free, No-Clean, Pb-Free S O L D E R P A S T E Click our video for more: Contact our engineers today: techsupport@indium.com Learn more: www.indium.com/avoidthevoid/SMTUS ©2018 Indium Corporation Typical Voiding >40% Void Area Indium10.1HF <10% Void Area Visit us at IPC APEX: Booth 1625

• Cover
• Featured Content — Communicating with Your Customers
• Additional Content
• Column — Talk to Your Customers
• Column — New Year Resolutions and Best Wishes
• Feature — Communications: Bridging the Customer-Supplier Gap
• MilAero Highlights
• Feature — Defining Customer-Supplier Relationships and Customer Satisfaction
• Supply Line Highlights
• Feature — Working with Customers: A Consultant's Perspective
• EIN & Market Highlights
• Feature — Exceeding Customer Expectations
• Short — Making IoT Possible with a New Breed of Memristors
• Article — Machine Assist Time
• Short — Cicor's Approach to Miniaturization: Cost of Function, and More
• Feature Interview — Growing with the Customer
• Short — Indium's Karthik Vijay Talks Engineering for Automotive Applications
• Article — Improving SMT Yield and Reducing Defects: A Rauland Case Study
• Short — Rewritable Wires Could Mean No More Obsolete Circuitry
• Top 10 Recent Highlights from SMT007.com
• Career Opportunities Section
• Events Calendar