FEBRUARY 2018 I DESIGN007 MAGAZINE 83
5
I-Connect007 Launches
Fundamentals of RF/Microwave
PCBs Micro eBook
E
Written by John Bushie,
director of technology at
American Standard Circuits,
and Anaya Vardya, presi-
dent and CEO of ASC, this
micro eBook provides infor-
mation needed to understand
the unique challenges of RF/
microwave PCBs.
6
Rogers Continues Expansion into
High-Speed Digital Materials
E
Mahyar Vahabza-
deh discusses a
paper presented
by his colleague
Dr. Allen Horn
at DesignCon.
He also explains
some of the different characteristics Rogers
has discovered as they move from RF into
high-speed digital materials.
7
Cadence Reports Q4 and Fiscal
Year 2017 Financial Results
E
Cadence reported 2017
revenue of $1.943 bil-
lion, compared to rev-
enue of $1.816 billion for
2016. Cadence recognized
net income of $204 mil-
lion, compared to net
income of $203 million for 2016. Revenue for
the fourth quarter of 2017 totaled $502 million,
compared to revenue of $469 million reported
for the same period in 2016.
8
Fully Automated Schematic
Verification
E
The schematic is the controlling document for
every PCB design. It captures the design intent
and drives all downstream processes including
simulation, analysis, layout, fabrication, and
assembly. As such, it is critical that the sche-
matic accurately reflects the product's elec-
tronic requirements and specifications. Men-
tor's Craig Armenti explains.
9
APCT's Cartel Acquisition Adds
Capacity, Technology and
Certifications
E
APCT recently acquired Cartel
Electronics and its affiliate,
flex and rigid-flex maker
Cirtech. During DesignCon
2018, I spoke briefly with
APCT President and CEO
Steve Robinson about what
this acquisition means for the San Jose-based
fabricator.
J
Mike Jouppi Discusses his Drive
for Better Thermal Data
E
Mike Jouppi is an engineer
and founder of the Thermal
Management LLC consulting
firm. He spent years updating
IPC's charts on current-carry-
ing capacity, which had been
unchanged since the 1950s. An advocate of
a multi-physics approach to solving thermal
issues, Mike is always on the cutting edge of
electronics cooling. I recently caught up with
Mike and asked him to give us his views on the
state of thermal management, as well as the
tools and standards related to thermal design.
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