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Page 32 of 91

Minimizes solder beading High ECM performance under low standoff components High print transfer efficiency with low variation Excellent wetting Very low bridging, slump, and solder balling Indium10.1HF Halogen-Free, No-Clean, Pb-Free S O L D E R P A S T E Click our video for more: Contact our engineers today: Learn more: ©2018 Indium Corporation Typical Voiding >40% Void Area Indium10.1HF <10% Void Area

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