www.iwlpc.com
2018
15
th
International Wafer-Level Packaging Conference
Contact Jenny Ng
jenny@smta.org 952-920-7682
Call for Participation
The International Wafer-Level Packaging Conference
Technical Commitee invites you to submit an
abstract for presentations, posters and workshops.
Abstracts Deadline: April 10, 2018
*Technical papers are required*
Submit online www.iwlpc.com
Suggested Topics
Wafer-Level Packaging
3D Packaging Integration
Advanced Integrated Systems and Devices
Advanced Wafer-Level Manufacturing and Test
October 23-25, 2018
DoubleTree by Hilton San Jose, CA
Organized by:
