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REGISTER AT WWW.MEPTEC.ORG TODAY! MEPTEC2018 REGISTER TO ATTEND TODAY! INDUSTRY SPONSOR Flexible Hybrid Electronics – Disrupting Conventional IC Packaging and System Design Solutions WILFRIED BAIR Senior Engineering Manager, Device Integration & Packaging NextFlex KEYNOTE SPEAKER An Alternative History of the Electronics Manufacturing Industry JOSEPH (JOE) FJELSTAD Founder and President Verdant Electronics KEYNOTE SPEAKER U nlike computers and mobile phones, the Internet of Things demands a wide range of different functions in different products, and most of them need flexibility, thinness, and ultralow power consumption. These requirements can only be satisfied with new methods of packaging. This event will explore the market opportunities, emerging applications, and materials and process requirements to provide this functionality at an affordable cost. You'll hear from experts in polymers and other flexible ma - terials, effects of complex packaging structures on signal integrity, speed and power consumption, and the latest and most promising technology for heterogeneous packaging. Topics will also include cutting edge/niche concepts in medical implantable devices and "synthetic skin", etc. The challenges include: Handling and protecting thin and small components made from brittle materials (silicon, III-V compounds, etc.) Flexible interconnects on a wide range of scales from microns to millimeters Reliability with thermal expansion coefficients of different components ranging from a few ppm to hundreds Cost-effective process techniques for putting it all together THURSDAY, APRIL 26, 2018 | 8:00AM - 4:00PM NEXTFLEX MANUFACTURING FACILITY TOUR | 4:00PM – 4:30PM NEXTFLEX FACILITY | SAN JOSE, CALIFORNIA Cost-effective Assembly & Packaging Technologies MEPTEC2018 HOSTED BY A Special One-Day Event Presented By MEPTEC NEW GENERATION FLEXIBLE HYBRID ELECTRONICS Sponsorship Opportunities are Available for this Event. Email gedwards@meptec.org