Solder Fortification
®
Preforms
©2018 Indium Corporation
QFN
Edge Connector
Through-hole
RF Shielding
• Increase solder volume to strengthen solder joint
• Improve shape and volume of fillet to ensure joints meet IPC specifications
• Eliminate costly, time-consuming processes
• Packaged in tape & reel to maximize pick rate
Contact our engineers today: techsupport@indium.com
Learn more: www.indium.com/SMTUF
Contact us for the Solder Fortification
®
Design Guide
Click our video for more:
