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REGISTER TODAY! Keynote Presentation Automotive Electronics Technologies/Roadmaps Dwight Howard, APTIV Program Sessions » Design, Manufacturing and Assembly Rework » Conformal Coating and Product Reliability » Inspection and Quality » Big Data and Manufacturing Considerations » Paste Printing and Soldering » Cleaning Challenges for Board Assemblies and Harsh Environment » Advanced Packaging SBL Claimable. If you need payment options other than credit card or check, please contact or call 04-6433817 or H/P: 012-5596836 The conference is claimable from HRDF under SBL scheme Professional Development Courses PDC1 Understanding Parameters Affecting Barrel Fill in Wave Soldering Process AF Ng, Techment Consultancy Sdn. Bhd. PDC2 Flip Chip, WLCSP, and FOWLP Assembly and Reliability John Lau, Ph.D., ASM Pacific Technology CONTACT Jenny Ng Conference and Education Manager +1-952-920-7682 Register now and learn about new assembly technology, growing yield and increasing reliability. This global conference is a strong technical three-day event focused on today's most important and timely issues in electronics manufacturing. In partnership with: Supported by Persatuan Surface Mount Technology P. Pinang.

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