Issue link: https://iconnect007.uberflip.com/i/960726
40 I-CONNECT007 I SHOW & TELL MAGAZINE 2018 plant. I was transferred to Ocala. And that was a rude awakening because that was all manu- facturing and all done to standards. It was a real eye-opener. Then I started reading these standards and thinking, what? Why? So, once I had questions for the committee, that's when I got involved. That was probably in the mid-90s. I immediately saw the need for getting involved. You know, tell me why I'm doing this or doing that. Goldman: When you went to those committees, did you get your questions answered? I'm sure you got volunteered to work on something. Woody: Oh sure. Because they want you to come with data. You can question all you want, but you've got to come with data and I've always been a real proponent of that. My comment is always "show me the data." You can't just put things in standards because you think they should be there. You've got to prove it. And in fact, Dieter was one of the first gentlemen that I worked with at IPC, they were starting up the ball grid array committee. Dieter was one of my first mentors and adversaries. Goldman: Gee, imagine that. Woody: Yeah, imagine that, but he was always a really good friend. I loved Dieter to death. Goldman: What committees and sub-committees have you been involved in over the years? Woody: Oh geez. I'd almost have to have the list in front of me. Of course, 001 and A610, those are the big ones. I was in electronics manufacturing. Then there are all the bare boards documents, but I usually had somebody else at Lockheed han - dling those. And I've been in the cleaning stuff since the very beginning because I was in charge of getting Lockheed out of the CFCs back in the '90s when we all had to get rid of our Freon. I was heavily involved in all that development work in the cleaning world and very involved in conformal coating, and I still am. I was also involved in all the solderability specs, like 002 and 003, the solder and flux specs, which I think are 005 and 006. So, pretty much everything that concerns assembly and materials. Goldman: And the more you get involved, the more you learn, right? Woody: Yes, and that's the good part of it, because you're getting to hear what everybody else is doing, what's working and what isn't. That's one of the real benefits of going to the committee meetings. It's nice to know that, "Oh you really did this? You really tried this? What happened? What kind of results did you get?" Goldman: Or "I have this problem; how can you help me or do you have advice?" What contri- bution do you feel you've made over the years? Woody: Oh, gosh. I don't know. I've done a whole lot of testing and brought a whole lot of data to different committees. You know, one thing or another. There's been so many of them. The most recent ones are the ones we've been doing with PERM, which is the conformal cod - ing coverage and what we call lead poisoning for tin-lead soldering. And those are two big round robins that are just finishing up and get- ting ready to publish. That's the most recent. But when I was in Ocala I had my own analyti- cal lab, so I would take on a lot of tasks, or at least be part of a round robin task. So there's been many, many of them. Goldman: Have any documents been published that you were involved with? Woody: Oh yes, there's been a number, and I couldn't list the numbers off the top of my head. The one we're publishing right now is the design for lead-free, and that's coming out of the PERM group. It is PERM-2901. It published in mid-February. Goldman: It's about design and assembly for lead-free, so that involves the entire supply chain, doesn't it? Woody: That's right.