PCB007 Magazine

PCB-Apr2018

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48 PCB007 MAGAZINE I APRIL 2018 Depending on the application and perfor- mance required for the end product, the 'e' or 'smartness' can be built in several ways along the product development process: • Fiber cross-section: conductivity can be the core, the exterior, striped • The conductive fiber can be blended with other fibers: it could be a filament (one continuous) or a staple fiber (cut) or that filament or staple can be splayed into a non-woven (directional, amorphous, as a layer, a surface, needle-punched, felted) • The conductive fiber could be twisted into a yarn either homogenous or part of a yarn • The conductive fiber could be braided • The conductive yarn can be: – knit u warp knitted: warp direction, weft direction segmented in warp or weft, vertical, horizonal, diagonal, or any combination of all of the above u Weft knitted, circular: striped, all over, spacer (face, reverse, interior, any or all of the above), plaited, jacquarded, terry, sliver knit Figure 3: Several ways to integrate electronic components and shielding into knitting.

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