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APRIL 2018 I PCB007 MAGAZINE 89 er processes and four parameters for waste wa- ter treatment (Table 9). Implementing a Controller The big advantage of continuous analysis, especially for copper plating additives, is that a consistent lower-level concentration can be maintained without exceeding the low-lev- el limit. This could be a 30% lower usage of chemical than allowed by periodic laboratory analysis by conventional CVS instruments, as seen in Figure 12. A basic automatic solution controller con- sists of four parts (Figure 13): • A sample collection delivery and preparation system. Table 5: What can be analyzed for in the electroless copper, additive MSAP and the rest of the electroless line. Table 6: What can be analyzed for plating lines of Cu, Ni, Sn, Sn-Pb, Au, Pa, Rh plus their cleaning process. Table 7: What can be analyzed for copper etching. Table 8: What can be analyzed for photoresist developer and strippers. Table 9: What can be analyzed for smear removal, oxides and waste water/incoming water treatment.