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MAY 2018 I SMT007 MAGAZINE 15 About the Author: Dr. Hwang, an international businesswoman, international speaker, and business and technology advisor, is a pioneer and long-standing contributor to SMT manufacturing since its inception, as well as to the lead-free electronics implementation. Among her many awards and honors, she is inducted to the International Hall of Fame for Women in Technology, elected to the National Academy of Engineering, and named an R&D-Stars-to- Watch and YWCA Achievement Award recipient. Having held senior executive positions with Lockheed Martin Corp., Sherwin Williams Co., SCM Corp, and IEM Corp., she is currently CEO of H-Technologies Group, providing business, technology and manufacturing solutions. She serves as Chairman of Assessment, on the Board of DoD Army Research Laboratory, on the Commerce Department's Export Council, on the National Materi- als and Manufacturing Board, and on various national panels/committees, Fortune-500 NYSE companies, and civic and university boards. Hwang also holds various international leadership positions. She is the author of 500+ publications and several books, and a speaker and author on trade, business, education, and social issues. Her formal education includes four academic degrees as well as the Harvard Business School Executive Program and Columbia University Corporate Governance Program. For more information, please visit strength (both yield and tensile strengths). More importantly, its thermal fatigue life is higher under harsh conditions (e.g., a large temperature swing, high-temperature excur- sion). Further important advantages of SnAg- CuBi over SnAgCu are its lower melting temperature and superior intrinsic wetting ability. The practical compositions can offer as much as 9°C lower in melting temperature than SAC305. Melting at a few degrees lower, SnAgCuBi compositions are advantageously positioned for circuit board manufacturing. Embracing diverse PCB assemblies and process window requirements to achieve high yield, low- production defect rates, an alloy having a melting temperature below 215°C is con- sidered necessary to deliver robust manu- facturability. Part 5 in this series will outline the under- lying operating mechanism among the four elements (Sn, Ag, Cu, Bi) of SnAgCuBi system and elemental dosages in relation to desirable performance properties. SMT007 References Environment-friendly Electronics—Lead-free Technology, Chapter 10, Electrochemical Publi- cations, Great Britain. Don Naugler, president and general manager of VJ Electronix Inc., talks about the challenges in rework and inventory control during the recent NEPCON China 2018 event in Shanghai. He sees increasing demand for rework solutions for larger board assem- blies, in particular, for 5G communications technologies. Naugler also discusses the challenges in reworking flexible circuit assemblies, and how operators can address them. Click image to watch this video. Growing Rework Demand from Assemblies for 5G, Communications Systems

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