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78 SMT007 MAGAZINE I MAY 2018 the following variations usually make process fluctuate, calling for consistent monitoring: • Solder paste height and volume • Diameter of side connection of BGA components • Diameter of side connection of PCB pad • Central bonding diameter of connections • Cavity size and occurrence rate • Tin balls. Solder paste thickness can be monitored by X-ray inspection equipment and process vari- ations can be controlled within a certain level based on solder joint shape and consistency. SMT007 Dora Yang is a technical engineer from PCBCart, a China-based full turnkey PCB assembly service provider. For any questions related to PCB design, manufacturing or assembly, reach Dora on Twitter, @dorayang0227 or directly at Figure 3. At the recent NEPCON China 2018 trade show in Shanghai, Ralf Wagenfuehr, plant manager at Rehm Thermal Systems, discusses how vacuum reflow helps reduce solder voiding and ensure reliable and stable reflow soldering processes. Click image to watch this video. Rehm Discusses How Vacuum Reflow Technology Helps Reduce Voiding

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