MAY 2018 I SMT007 MAGAZINE 81
5
5 Techniques Used to Detect
Counterfeit Electronic
Components
E
Although government pres-
sure and private resources
have helped minimize the
risk of counterfeit compo-
nents from entering the
supply chain, there is
still and will most likely
continue to be, a prominent threat. So, what
can you do to minimize this risk? Read on.
6
RTW IPC APEX EXPO: Zentech
Discusses New NIST Legislation
E
Matt Turpin, president and
CEO of EMS firm Zentech
Manufacturing Inc., speaks
about the NIST 800-171
legislation published by the
National Institute of Stan-
dards and Technology, and
how it is different from other regulations such
as ITAR.
7
Fabrinet Upgrades SMT Facility
with Class 8 Clean Room
E
Fabrinet UK
has upgraded
its On-Demand
facility to offer
a Class 8 clean
room. The unit,
part of its high
mix low volume manufacturing facility in the
UK is already being widely used by customers
across both A&D and Telecoms.
8
RTW IPC APEX EXPO:
Miraco Company and
Services Introduction
E
Miraco's current quality
manager, William Pfings-
ton, fills Guest Editor Steve
Williams in on the company's
contract manufacturing capa-
bilities and services, includ-
ing strengths in design and
flex circuits. He also talks about the company's
expansion and organizational changes.
9
Four Conferences for the
First Time at electronica
E
The conferences in the
context of electronica
are getting new addi-
tions this year. In addi-
tion to the Automotive
Conference, Embedded
Platforms Conference and Wireless Congress,
the Medical Electronics Conference, all dealing
with developments and trends in electronics,
will take place for the first time.
J
IPC Publishes Standard on
Low-Pressure Molding for
Circuitry Encapsulation
E
IPC announces a new standard, IPC-7621,
Guideline for Design, Material Selection and
General Application of Encapsulation of Elec-
tronic Circuit Assembly by Low Pressure Mold-
ing with Thermoplastics, a guidance document
that offers instruction on using Low Pressure
Molding (LPM) in place of potting for circuitry
encapsulation.
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