San Jose, California, USA
October 23-25, 2018
2018 Sponsors
Gold
October 23-24, 2018
October 25, 2018
Event Schedule
Silver
Conference Questions:
Jenny Ng
jenny@smta.org
Platinum
Exhibit & Sponsorships:
Kim Newman
knewman@chipscalereview.com
www.iwlpc.com
Driving an Interconnected World
Supporting media
Organized by Organized by
2018
15
th
International Wafer-Level Packaging Conference
- Exhibition
- Keynote Speakers
- Panel Discussions
- Technical Tracks:
- 3D
- WLP
- Advanced Wafer-Level
Manufacturing and Test
- Networking Reception
- Professional Development
Courses
Keynote Presentations
Growth of WLSI and Wafer Foundry with Moore's Law
and More-than-Moore, and Vice Versa
Douglas C.H. YU, Ph.D.
Vice President, Research and Development
Taiwan Semiconductor Manufacturing Company
Monolithic versus Heterogeneous
Packaging: Where Does the Future Lie?
Walden Rhines, Ph.D.
President and Chief Executive Ocer
Mentor, a Siemens business
Interconnected World and the Automotive Paradigm
Veer Dhandapani, Ph.D.
Head of Automotive Packaging
NXP Semiconductors
Supported by:
