SMT007 Magazine

SMT-Sept2018

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San Jose, California, USA October 23-25, 2018 2018 Sponsors Gold October 23-24, 2018 October 25, 2018 Event Schedule Silver Conference Questions: Jenny Ng jenny@smta.org Platinum Exhibit & Sponsorships: Kim Newman knewman@chipscalereview.com www.iwlpc.com Driving an Interconnected World Supporting media Organized by Organized by 2018 15 th International Wafer-Level Packaging Conference - Exhibition - Keynote Speakers - Panel Discussions - Technical Tracks: - 3D - WLP - Advanced Wafer-Level Manufacturing and Test - Networking Reception - Professional Development Courses Keynote Presentations Growth of WLSI and Wafer Foundry with Moore's Law and More-than-Moore, and Vice Versa Douglas C.H. YU, Ph.D. Vice President, Research and Development Taiwan Semiconductor Manufacturing Company Monolithic versus Heterogeneous Packaging: Where Does the Future Lie? Walden Rhines, Ph.D. President and Chief Executive Ocer Mentor, a Siemens business Interconnected World and the Automotive Paradigm Veer Dhandapani, Ph.D. Head of Automotive Packaging NXP Semiconductors Supported by:

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