Design007 Magazine

Design007-Oct2018

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R E G I S T E R O N L I N E T O D A Y A T W W W . M E P T E C . O R G MEPTEC continues to cover leading-edge topics in semicon- ductor packaging with its Fall 2018 Symposium "Heteroge- neous Integration: The Path Forward." Industry leaders will present the latest updates on technical and business issues related to integration of different types of semiconductor de- vices. This field has been identified as the next critical area for the semiconductor industry to continue to advance, as prog- ress via Moore's Law scaling becomes increasingly cost-pro- hibitive or prevented by insurmountable technical challenges. With progress in many areas, cost and performance benefits are finally being realized, and previously impossible combi- nations of devices are now possible. Don't miss this unique opportunity to get up to speed at MEPTEC's symposium "Heterogeneous Integration: The Path Forward" on December 5, 2018 in Milpitas, CA. Sponsorship Opportunities and Exhibit Spaces Available WEDNESDAY, DEC. 5, 2018 | SEMI GLOBAL HEADQUARTERS | MILPITAS, CA SYMPOSIUM 8:00AM - 5:00PM | EXHIBITS 9:30AM - 6:30PM | RECEPTION 5:00PM - 6:30PM MEPTEC2018 KEYNOTE SPEAKER Heterogeneous Integration: Is it Ready for Changing the Packaging Landscape? Risto Puhakken, President, VLSI KEYNOTE SPEAKER Disruption is Coming: Adapt, Change or Be Left Behind Keith Felton, Product Marketing – IC Packaging, Mentor Graphics Board Systems Division KEYNOTE SPEAKER Heterogeneous Integration Roadmap and SiP William "Bill" Chen, ASE Fellow and Senior Technical Advisor, ASE Group MEDIA SPONSORS SPONSORS AND EXHIBITORS

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