40 DESIGN007 MAGAZINE I OCTOBER 2018
EPTE Newsletter: New Materials for
Wearable Electronics E
Technology continues to evolve, and wear-
able electronics are the focal point for many
new concepts. The next generation of wearable
products for the consumer electronics indus-
try will create a new market with nothing but
upside for manufacturers and suppliers.
Flex Talk: Mina—RFID, LED and What Else? E
"The science of today is the technology of
tomorrow." This Edward Teller quote is an apt
description of the Mina product. This advanced
surface treatment recently developed to enable
low-temperature soldering to aluminum in the
RFID market is finding success in that market
and quickly finding a home in other markets—
including the LED market—where the incentive
is both cost and improved LED performance.
PCB Designers: Perfect Your Data Package
with New eBook from Prototron E
For PCB designers, producing a comprehen-
sive data package is crucial. If even one impor-
tant file is missing or output incorrectly, it can
cause major delays and potentially ruin the
experience for every stakeholder. Learn how to
perfect your data package with I-Connect007's
most recent title: The Printed Circuit Designer's
Guide to… Producing the Perfect Data Package.
Rogers to Highlight Latest Circuit Materials
and Share Expertise at EDI CON USA 2018 E
Rogers Corporation will share its experience
and expertise on circuit materials technologies
at the 2018 Electronic Design Innovation Con-
ference (EDI CON USA 2018) October 17–18,
in the Santa Clara Convention Center (Santa
Clara, California). EDI CON USA 2018 is enter-
ing its third year of serving the high-frequency
RF/microwave design engineering community.
Standard of Excellence: Working for the
Future—Partnering with PCB Vendors on
Innovative Technology E
The true test of the vendor-customer rela-
tionship comes when you need innovative
PCBs—boards that are not easily found in the
common marketplace and are so technologi-
cally advanced that they require your design-
ers and suppliers to work together to go where
neither has before.
Alun Morgan Named Technology
Ambassador for Ventec E
Ventec International Group Co., Ltd.,
announced that Alun Morgan, chairman of
the EIPC, has been named technology ambas-
sador for Ventec International Group.
American Standard Circuits Launches
Fusion Bonding for RF Boards E
American Standard Circuits is now offering
fusion bonding of PTFE-based materials. Fusion
bonding of PTFE-based materials involves
using high temperatures (≥700°F/371°C) to
bond PTFE directly to the copper circuitry and
surrounding PTFE.
Building a Better Board: It Always Comes
Back to Communication E
For our experts meeting on the August's
theme of reliability, we reached out to Colo-
nial Circuits and asked them to participate in
a conference call with our I-Connect007 edi-
torial team consisting of Dan Feinberg, Andy
Shaughnessy, Patty Goldman, and Happy
Holden. Joining the call from Colonial Circuits
was Mark Osborn, president and CEO, Kevin
Knapp, quality manager, and Rodney Krick,
manufacturing manager.
