Consistency Drives the Value
Affinity ENIG 2.0, when used with MultiPrep
200, delivers the best of both worlds:
unmatched ENIG consistency and ultra
strong soldermask adhesion.
AFFINITY 2.0
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ELECTROLESS NICKEL /
IMMERSION GOLD
Affinity Process Variation
gold thickness (microinches)
MULTIPREP 200
FOR ULTIMATE
SOLDERMASK ADHESION
Traditional brush scrub and commodity copper etch
result in a copper-to-soldermask bond that's vulnerable
to harsh ENIG chemistry and temperatures.
Engineered copper texturing, provided by MultiPrep 200,
paired with the unrivaled process control of Affinity 2.0,
produce a superior soldermask interface.
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