SMT007 Magazine

SMT007-Apr2020

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APRIL 2020 I SMT007 MAGAZINE 93 5 I-007e Micro Webinar: Primary Flight Control Case Study on Condensation and Coverage E The seventh episode of the popular webinar series "Coatings Uncoated!" is now available to view. Author of The Printed Circuit Assem- bler's Guide to Conformal Coatings for Harsh Environments and topic expert Phil Kinner from Electrolube shares highly focused educa- tional information on conformal coating and encapsulation. If you are in the assembly busi- ness, an EMS, or responsible for specifying conformal coating and/or encapsulation, then this free series is for you. 6 Congratulations to Steve Pudles! IPC Hall of Fame 2020 Inductee E With over 32 years spent work- ing with IPC, Steve Pudles was elected to the IPC's Hall of Fame this year. Patty Goldman spoke with Steve about how he first became involved as well as his time in the organization, including his work with the EMS Management Council. 7 Joe Fjelstad Breaks Down His Occam Process E Joe Fjelstad recently met with the I-Connect007 Editorial Team to discuss the potential benefits of his Occam process for solderless assembly. This technique allows assembly of the PCB without the risks associated with traditional surface-mount processes, such as solder joint failure. Has the time come for the industry to embrace Occam? 8 Foundations of the Future: STEM Student Outreach Program at IPC APEX EXPO 2020 E When IPC holds an event, there is nothing more reward- ing than words like these from Diego, Mount Miguel High School: "I learned many valuable pieces of informa- tion related to engineering careers. My favorite topic to learn about was PCBs." Charlene Gunter du Plessis shares the success of the IPC STEM Student Outreach Program, as well as other updates from IPC APEX EXPO 2020. 9 Zentech Manufacturing Inc. Acquires CAMtek Inc. E Zentech Manufacturing Inc. is pleased to announce the acquisition of CAMtek Inc. J Zulki's PCB Nuggets: Putting the Heat on for Thermal Profiling E A unique thermal profile is designed for each PCB job undergoing conventional SMT assembly, as virtually every PCB assembly professional knows. But what about a PCB assembly project involving both conventional rigid board and an extraor- dinarily small rigid or rigid-flex circuit under- going microelectronics assembly? Zulki Khan covers PCB hybrid assembly, which requires two separate, unique, and distinctly different thermal profiles. Steve Pudles Gunter du Plessis Zulki Khan

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