PCB007 Magazine

PCB007-Sept2020

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The corrosion free solution for ENIG and ENEPIG Aurotech ® G-Bond 2 is the new gold electrolyte which fulfills all standards for ENIG and ENEPIG with highest reliability. The process offers the benefits of a low gold content while achieving excellent thickness distribution at the same time. Both contribute to significant cost savings by reduced drag out losses and tightened thickness ranges. The production proven automated dosing system, which is complementary to Aurotech ® G-Bond 2, ensures easy handling and consistent process conditions in work and idle times. g/l gold content in plating solution atotech.com Global head office Atotech Group +49 30 349850 info@atotech.com Aurotech ® G-Bond 2 Pic. 1: Applicable for Au-wire bonding on ENEPIG Pic. 2: Corrosion free ENIG and ENEPIG Mixed reac on gold for corrosion free ENIG and ENEPIG The new gold electrolyte 0.5 10 µm and lower CoV for thickness distribution 5%

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