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30 SMT007 MAGAZINE I OCTOBER 2020 In DARPA's CHIPS program, part of the out- put was some very advanced designs and inte- gration schemes, but getting those interposers manufactured and devices assembled was dif- ficult because those capabilities aren't really available on a merchant basis in the U.S. Another output from the CHIPS program was a "wish list" for a national capability for inter- poser-based assembly. This was input into the SHIP program. SHIP is a Naval Surface Warfare Center program for "State-of-the-Art Heterogeneous Integrated Packaging." This program is underway, and all of the detailed specifications and metrics for the SHIP program will be very helpful for the HIR. Johnson: There is a lot of implied impact on PCB fabrication and assembly down the line as heterogenous integration becomes more prev- alent. Demmin: Definitely. All the advanced R&D like at DARPA is necessary, but a lot of it comes back to the PCBs for the advanced package substrates. That's where the rubber hits the road. The large volume of everything depends on the circuit board. DARPA frequently uses a slide that shows that the PCB is the original heterogeneous inte- gration platform, and it arose out of the need during World War II for a proximity fuse. They needed to get a lot of functionality within the small device, and the first high-volume PCB was the answer. The most advanced packaging substrate is conceptually no different from that PCB from 75 years ago. Johnson: Do you have some specific feedback you'd like to hear from industry participants? Demmin: We have a few others besides Tim and me, but we'd appreciate anyone who can help with informed input. To provide some focus, I've sent them this table, asking them to pro- vide inputs on whether there should be other rows and get their input on what they think is state of the art, what they think it should be, and where it's headed. We're theoretically doing a 5-, 10-, and 15-year outlook, and it might be useful to have more granularity. Feed- back on this table is the main thing I've asked for from other volunteers and the audiences of these presentations. Johnson: Thank you very much, Jeff. Demmin: Thanks. SMT007 Editor's note: To learn more, read Demmin's article "The Heterogeneous Integration Road- map for Aerospace and Defense" on page 32 of this issue.

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