PCB007 Magazine

PCB007-Jan2021

Issue link: http://iconnect007.uberflip.com/i/1330321

Contents of this Issue

Navigation

Page 101 of 115

102 PCB007 MAGAZINE I JANUARY 2021 1 ECWC15 Virtual Conference Keynote: 5G PCB Technology and Material Challenges E The second day of the Electronic Circuits World Convention began with a keynote from Dr. Shi- uh-Kao Chiang, managing partner of Prismark, describing the PCB technology and material challenges presented by the introduction of the fifth-generation cellular wireless communica- tion network—the roll-out of which was con- tinuing in spite of the coronavirus pandemic. Technical Editor Pete Starkey has more. 2 Just Ask Tara Dunn: The Exclusive Compilation E We asked for you to send in your questions for Averatek's Tara Dunn, and you took us up on it! We know you all enjoyed reading these questions and answers, so we've compiled all of them into one article for easy reference. And if you'd like to hear more from Tara, be sure to view her Flex007 column series "Flex Talk." 3 Batteries and Data Centers E Mike Mosman recently sold his engineering company CCG Fa- cilities Integration; he is now the vice president of electri- cal engineering in mission-crit- ical facilities for Morrison Her- shfield. In this discussion, Mike explains how evolving battery technology and a strong de- mand are playing a key role in this area and others. 4 Prices of Copper-Clad Laminates Continue to Rise E Recently, two major explosions at epoxy resin plants in China had a great impact on domes- tic resin suppliers. Prices have risen steadily in 2020, with leading CCL manufacturers an- nouncing price increases of 20-30% recently. As the cost of raw materials such as electron- ic copper foil, resin and glass fiber have risen, the cost for manufacturing CCL has taken off as well. Editor Picks from PCB007 Tara Dunn Mike Mosman

Articles in this issue

Links on this page

Archives of this issue

view archives of PCB007 Magazine - PCB007-Jan2021