PCB007 Magazine

PCB007-Aug2021

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The new standard for IC substrates – High current density, productivity, and quality info @ atotech.com To find out more about InPro ® SAP6, scan the QR-Code to the right. w w w.atotech.com The PCB industry is continually driven by market demands for finer lines and spaces, as well as increased miniaturization. With our new InPro ® SAP6, Atotech meets and fulfils this ever-increasing demand. The BMV filling process for high-class IC substrates outperforms POR chemistry in every respect. It provides a superior surface finish, a higher current density, and excellent stability. InPro ® SAP6 is the solution of choice when it comes to the highest productivity and quality and works particularly well when combined with our vPlate ® equipment.

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