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Design007-Aug2022

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70 DESIGN007 MAGAZINE I AUGUST 2022 by Andy Shaughnessy I-CONNECT007 Electrical and mechanical engineers may be working on the same product development teams, but they speak different languages, and they have completely different objectives. As a result, these folks almost never use the same soware tools. Bu t Ca d e n c e's n e w Ce l s i u s Th e r m a l Solver is an exception to the rule. In a new CadenceTECHTALK webinar, "How Static and Dynamic IR Drop Analysis Can Help PCB Designs and Challenges," product manager Melika Roshandell and SerDes SI/PI engineer Karthik Mahesh Rao explain how the EE and ME can both use the Celsius ermal Solver to achieve their disparate objectives—at the chip and package/board levels. Melika discusses the solver 's capa- bilities on the PCB and packaging side, which are accessible dur ing pre -layout stages of the design cycle. Built on FEA and CFD engines, the solver can iden- t if y Joule heat ing on boards and pack- ages, and help deter- mine copper density, component spacing, and proper placement and size of thermal vias. She compares the results of the solver's dynamic Webinar Review: Thermal Integrity of High-Performance PCB Design Melika Roshandell

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