70 DESIGN007 MAGAZINE I AUGUST 2022
by Andy Shaughnessy
I-CONNECT007
Electrical and mechanical engineers may be
working on the same product development
teams, but they speak different languages, and
they have completely different objectives. As a
result, these folks almost never use the same
soware tools.
Bu t Ca d e n c e's n e w Ce l s i u s Th e r m a l
Solver is an exception to the rule. In a new
CadenceTECHTALK webinar, "How Static
and Dynamic IR Drop Analysis Can Help PCB
Designs and Challenges," product manager
Melika Roshandell and SerDes SI/PI engineer
Karthik Mahesh Rao explain how the EE and
ME can both use the Celsius ermal Solver to
achieve their disparate objectives—at the chip
and package/board levels.
Melika discusses
the solver 's capa-
bilities on the PCB
and packaging side,
which are accessible
dur ing pre -layout
stages of the design
cycle. Built on FEA
and CFD engines,
the solver can iden-
t if y Joule heat ing
on boards and pack-
ages, and help deter-
mine copper density, component spacing, and
proper placement and size of thermal vias. She
compares the results of the solver's dynamic
Webinar Review:
Thermal Integrity of
High-Performance PCB Design
Melika Roshandell
