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82 PCB007 MAGAZINE I SEPTEMBER 2023 Introduction In a previous column, the critical process of desmear and its necessity to ensure a clean copper surface connection was presented. Now, my discussion will focus on obtaining a void-free and tightly adherent copper plating deposit on these surfaces. Metallization Aer the desmear process, the task is to insure a continuous, conductive, and void- free deposit on the via walls and capture pad. Processes to Support IC Substrates and Advanced Packaging, Part 4 Today, there are several processes that can be utilized to render vias conductive, including: • Conventional electroless copper • Palladium-based direct metallization • Graphite direct metallization • Carbon black direct metallization • Conductive polymer direct metallization ese metallization processes (also known collectively as "making holes conductive" or MHC) are well developed for both plated through-hole and blind via metallization. Trouble in Your Tank by Michael Carano, IPC CONSULTANT