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4 SMT Magazine • May 2014 This month, our expert contributors shine a spotlight on the test and inspection of PCB assemblies. How can you ensure signal integrity in your test fixtures? What is the state of the ICT landscape? How can you utilize X-ray inspection to detect head-in-pillow defects? What's the best way to predict drop shock performance? How can executives best manage PCBA test, now and into the future? Read on! Head-in-Pillow X-ray Inspection by Alejandro Castellanos, Dr. Zhen (Jane) Feng, David Geiger, and Murad Kurwa mechanical Reliability: a New method to Forecast Drop Shock Performance by Ronald Frosch, Guenther Mayr, and Manfred Riedler PCBa Test: Enabling the Right management Practice by NK Chari The Changing Economics of In-Circuit Test by Alan Albee The Future of Test by Richard Ayes Signal Integrity in Test Fixtures by Rob Humphrey 16 30 58 64 78 50

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