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12 SMT Magazine • May 2014 by Dr. Jennie S. Hwang h-TeChnologieS group SmT PRoSPECTS & PERSPECTIvES ColuMn Tin Whiskers, Part 5: Impact of Testing Conditions In this installment of the tin whisker series, we'll take a look at the impact of testing condi- tions, and follow-up with this statement from Part 4: "…all-encompassing tests to confirm or deny the culprits for tin whiskers are prohibi- tively costly and time-consuming…" The JEDEC Solid State Technology Associa- tion (formerly known as the Joint Electron De- vice Engineering Council) has published sev- eral documents that address and/or are related to the testing of tin whiskers, which are good guidelines with which to start. • JEDEC Standard No. 201: Environmental Acceptance requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes • JEDEC Standard No. 22A12: Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes • JEDEC Standard No. 22-A104D: Temperature Cycling Primarily, three sets of testing conditions are included in the JEDEC documents: ambient temperature storage, elevated temperature stor- age and temperature cycling, with the follow- ing parameters: Room Temperature Humidity Storage 30 ± 2 ° C and 60 ± 3% RH (1000 hrs interval inspection /3000–4000 hrs total duration) Temperature Humidity Unbiased 60 ± 5 ° C and 87 + 3/-2% RH (1000 hrs interval inspection /3000–4000 hrs total duration) Temperature Cycling Lower end temperature: -55 to -40 (+0/-10) ° C Higher end temperature: +85 (+10/-0) ° C (500 cycles inspection /1000–1500 cycles duration/air to air/5–10 min soak/3 cycles per hour)