SMT007 Magazine

Assembly Materials for demanding applications SMT Solder Pastes SMT Adhesives Fluxes Conductive Adhesives Solder Wires and Pastes for Die Attach Pressure & Non-Pressure Sinter Materials Advanced Solder Pastes, Type 6-8 Solder Powders – Including Low-Alpha & Ultra-Fine grades Heraeus Materials Technology North America LLC 301 N. Roosevelt Avenue Chandler, AZ 85226 +1 (480) 403-5345 www.heraeus-contactmaterials.com Visit us at IPC APEX Expo 2015 San Diego Booth #3401

• Cover
• Featured Content — Tin Whiskers
• Contents
• Column — Bits and Pieces
• Column — New Year Outlook: What Can We Expect in 2015?
• Feature — Risk and Mitigation for Tin Whiskers and Tin Pest
• Video Interview — IPC Focuses on Training Project, Contributing to Chinese Market
• Feature — Electrostatic Mechanism of Nucleation and Growth of Metal Whiskers
• Short — Laser-induced Graphene Vital for Flex Electronics
• Feature — Tin Whiskers: Why Testing Temperature Can Change the Outcome
• Feature — Tin Whiskers Remain a Concern
• Feature — Tin Whisker Growth on the Surface of Tin-Rich Lead-Free Alloys
• Feature — The Unpredictability of Tin Whiskers Endures
• News — Market Highlights
• Feature — Tin Whisker Risk Assessment of a Tin Surface Finished Connector
• Feature Column — Minimizing the Risk of Tin Whisker Formation in Lead-Free Assemblies
• Show Preview — Welcome to the 2015 IPC APEX EXPO Show Guide
• Show Preview — Keynote Speakers
• Show Preview — Buzz Sessions, Management Meetings and Technical Conference
• Show Preview — Development Courses, The PCB List and Real Time with...
• News — Mil/Aero007 News Highlights
• Column — Stop the SMT Conspiracy, Part 2: Abduction
• News — SMT007 Supplier/New Product News Highlights
• Column — How to Select a Pick-and-Place Machine, Part 1
• Short — Researchers Manipulate Nanoribbons at Molecular Level
• News — Top Ten News Highlights from SMT007 this Month
• Events Calendar
• Advertiser Index and Masthead