SMT007 Magazine
SMT-Sept2016
Issue link:
https://iconnect007.uberflip.com/i/721932
Contents of this Issue
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Articles in this issue
Cover
Featured Content — Military and Aerospace
More Content
Column — Failure is Not an Option
Short — I-Connect007 Survey: A Look at the Mil/Aero Industry—ITAR
Column — The Theory Behind Tin Whisker Phenomena, Part 4
Feature — The Blackfox Advanced Manufacturing Program for Military Veterans
Feature Interview — Asteelflash on Mil/Aero Challenges, ITAR Compliance, and Opportunities
Column — Recycling Substrates and Components in Mil/Aero Assemblies: Secure Metals Recovery
Supply Lines Highlights
Feature — Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow—Results of an Industry Round-Robin
Short — South Carolina's Aerospace Industry Trends Towards Sustainable Growth
Column — Smart for Smart's Sake, Part 1
Short — I-Connect007 Survey: A Look at the Mil/Aero Industry—Lead-Free
MilAero007 Highlights
Feature — IPC Certification Program's Space Hardware Addendums Training and Certification
Column — The Child is Father of the Man: Turning the Relationship Between the Electronic Product Assembly Employer and Recent Graduates Upside Down
EIN Market Highlights
Feature — IPC-1782 Standard for Traceability Supporting Counterfeit Component Detection
Column — How to Specify a Custom Machine
Feature — Defect Features Detected by Acoustic Emission for Flip-Chip CGA/FCBGA/PBGA/FPBGA Packages and Assemblies
Short — System Might Detect Doctored Images and Videos for the Military
Feature Interview — Ionics Talks Industry 4.0, Mil/Aero Opportunites, and Supply Chain
Top Ten Recent Highlights from SMT007
Events Calendar
Advertiser Index and Masthead
Back Cover
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