Design007 Magazine

PCBD-Mar2017

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Don't Let Your Temperatures Rise www.rogerscorp.com/acs Don't let your temperatures rise. Use Rogers' thermal management solutions. USA - AZ, tel. +1 480-961-1382 EUROPE - BELGIUM, tel. +32 9 235 3611 Let ROGERS' Thermal Management Solutions Keep You Cool COOLSPAN® TECA Film • 92ML™ StaCool™ Laminates • ML Series™ Laminates & Prepregs Keep You Cool COOLSPAN® TECA Film • 92ML™ StaCool™ Laminates • ML Series™ Laminates & Prepregs Heat can be damaging, especially when it is not managed. That's why Rogers Corporation invested so much time and energy into creating an array of material-based thermal management solutions to keep heat rise to a minimum in printed circuits. From automotive circuits to LED modules to power supplies, ML Series laminates and prepregs e ectively conduct heat away from the source, while COOLSPAN thermally & electrically conductive adhesive (TECA) materials enhance the thermal management of new and existing designs. And for that extra cooling edge, 92ML StaCool laminates feature a thermally conductive metal bottom plate to enhance the heat dissipation. Don't let your temperatures rise. Use Rogers' thermal management solutions. thermally conductive metal bottom plate to enhance the heat dissipation.

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