the PCB Magazine

PCB-May2017

Issue link: http://iconnect007.uberflip.com/i/819981

Contents of this Issue

Navigation

Page 68 of 111

Contact us More information Low stress, Low CTE, Ultra-thin IC substrate materials May 30 - June 2, 2017 Walt Disney World Swan and Dolphin Resort, FL ・ Decrease the warpage by low stress ・ Available to wide range of IC packages (FC-CSP) Features Laminate R-G525 Prepreg R-G520 Comparison of warpage in various IC Packages Our Booth # 507 -150 -100 -50 0 50 100 150 200 25℃ 260℃ R-G525 (E glass) 3ppm material (S glass) -150 -100 -50 0 50 100 150 200 25℃ 260℃ R-G525 (E glass) 2ppm material (S glass) -150 -100 -50 0 50 100 150 200 25℃ 260℃ R-G525 (E glass) 2ppm material (S glass) Warpage IC Packages Warpage (μm) Warpage (μm) Warpage (μm) Chip 150μm Substrate 260μm Chip 150μm Substrate 160μm Chip 100μm Substrate 160μm

Articles in this issue

Links on this page

Archives of this issue

view archives of the PCB Magazine - PCB-May2017