PCB007 Magazine

PCB-May2017

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Contact us More information Low stress, Low CTE, Ultra-thin IC substrate materials May 30 - June 2, 2017 Walt Disney World Swan and Dolphin Resort, FL ・ Decrease the warpage by low stress ・ Available to wide range of IC packages (FC-CSP) Features Laminate R-G525 Prepreg R-G520 Comparison of warpage in various IC Packages Our Booth # 507 -150 -100 -50 0 50 100 150 200 25℃ 260℃ R-G525 (E glass) 3ppm material (S glass) -150 -100 -50 0 50 100 150 200 25℃ 260℃ R-G525 (E glass) 2ppm material (S glass) -150 -100 -50 0 50 100 150 200 25℃ 260℃ R-G525 (E glass) 2ppm material (S glass) Warpage IC Packages Warpage (μm) Warpage (μm) Warpage (μm) Chip 150μm Substrate 260μm Chip 150μm Substrate 160μm Chip 100μm Substrate 160μm

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