PCB007 Magazine

Contact us More information Low stress, Low CTE, Ultra-thin IC substrate materials May 30 - June 2, 2017 Walt Disney World Swan and Dolphin Resort, FL ・ Decrease the warpage by low stress ・ Available to wide range of IC packages (FC-CSP) Features Laminate R-G525 Prepreg R-G520 Comparison of warpage in various IC Packages Our Booth # 507 -150 -100 -50 0 50 100 150 200 25℃ 260℃ R-G525 (E glass) 3ppm material (S glass) -150 -100 -50 0 50 100 150 200 25℃ 260℃ R-G525 (E glass) 2ppm material (S glass) -150 -100 -50 0 50 100 150 200 25℃ 260℃ R-G525 (E glass) 2ppm material (S glass) Warpage IC Packages Warpage (μm) Warpage (μm) Warpage (μm) Chip 150μm Substrate 260μm Chip 150μm Substrate 160μm Chip 100μm Substrate 160μm

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• Featured Content
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• Column: Help Wanted—And How!
• Short — It's Only Common Sense: Putting Your Team Together
• Help Wanted Section Begins
• Feature Column — Finding the Next Generation of "Board Rats"
• Feature Interview — "Help Wanted" with IMI's Peter Bigelow
• Feature Interview — Dave Ryder on Prototron Circuits' Strategy for Hiring in Today's Marketplace
• Supply Lines Highlights
• Feature Column — Recruiting and Retaining Young Talent
• Feature Interview — Rockwell Collins' Doug Pauls Discusses Volunteering, Mentoring and their Road Show
• Short — IPC's U.S. Skills Gap Study Reveals Qualifications in Short Supply
• Feature Interview — David Dibble on the Hiring Process: Getting the Most from Systems Excellence
• Short — The Conference Board LEI for the U.S. Rose in March
• Feature Column — Employee Recognition: More than Money
• Short — It's Only Common Sense: Let's Talk Leadership
• EIN Market Highlights
• Feature Interview: How to Find—and Retain—The Right People for the Right Jobs
• Feature Column — Random Thoughts on Employment, from Both Sides of the Table
• Short — CEO Confidence at Highest Levels since 2004
• Feature Interview — A Conversation with an Industry Twenty-Something
• Short — Americans' Economic Anxiety Declined in the First Post-Election Marketplace
• MilAero007 Highlights
• Feature Interview — Industry Knowledge—Preparing the Next Generation
• Column — The Desmear Defect Guide
• Column — Flying Probe Testing vs. IPC-9252B
• Column — China—A Critical Partner for Trade
• Help Wanted Ads
• Top Ten Recent Highlights from PCB007
• Events Calendar
• Advertiser Index and Masthead
• I-Connect007 Magazine Ad