the PCB Magazine

PCB-July2017

Issue link: http://iconnect007.uberflip.com/i/845602

Contents of this Issue

Navigation

Page 71 of 115

72 The PCB Magazine • July 2017 by Steve Williams THE RIGHT APPROACH CONSULTING IPC continues to lead our industry by exam- ple with their inaugural Reliability Forum, held in Chicago in April. The event was focused on manufacturing high-performance products and featured industry royalty from both a speaker and audience standpoint. Event Background The event steering committee charged with developing the forum was headed by Program Chair Michael Carano, and included Don Du- priest, Michael Jawitz, Craig Hillman, Gary Fer- rari, Jack Fisher, Denny Fritz, and Sanjay Hupri- kar, VP of the IPC Member Services. Mike Cara- no, VP of RPB Chemical Technologies served as the forum's ringleader, host and emcee. I was fortunate enough to have been asked to partic- ipate and speak at the event, and I feel an obli- gation to let those who were not able to attend this year know what an invaluable education- al opportunity this ongoing forum presents for our industry moving forward. The Audience The forum was extremely well attended, with a veritable who's who of our industry's supply chain, including raw material and equip- ment suppliers, PCB fabricators, contract man- ufacturers and OEMs. Companies represented included: Amphenol, Atotech, Aurora Circuits, CTS, DfR Solutions, Dow Chemical, Dow Elec- tronic Material, DuPont–RTP, Embraer S.A., Ex- treme Engineering Solutions, FTG Circuits, HDP User Group International, Holaday Circuits, In- trinsiq Materials, Inventec Performance Chemi- cals, IPC, KEMET Electronics, Lockheed Martin Space Systems, Lockheed Missiles and Fire Con- trol, MacDermid Enthone, MED-EL, Minco, Mo- torola, Nexteer Automotive, Northrop Grum- man, NSWC Crane, NTS, Orbital, Park Electro- chemical, Penn State University, Precision An- alytical Laboratory, Prismview, Raytheon, RBP Chemical Technology, Rockwell Collins, Rolls- Royce, SAIC, Summit Interconnect, The Right Approach Consulting, ThingWeaver Solutions, TTM Technologies, Ventec, and ZESTRON. The Topics The Steering Committee did a wonderful job of assembling a lineup of topics that were both relevant to the forum's theme of manufac- turing high-performance products, and present- ing insight from our industry's brightest tech- nological minds. What follows is a brief high- light of each speaker's presentation. Review of the 2017 IPC Reliability Forum FEATURE Figure 1: Keynote by Phil Titterton, TTM.

Articles in this issue

Archives of this issue

view archives of the PCB Magazine - PCB-July2017