SMT Magazine

SMT-Aug2017

Issue link: http://iconnect007.uberflip.com/i/855901

Contents of this Issue

Navigation

Page 32 of 87

Click our video for more: ©2017 Indium Corporation Typical Voiding >40% Void Area Indium8.9HF <15% Void Area Contact our engineers today: techsupport@indium.com Learn more: www.indium.com/avoidthevoid/SMTUS Indium8.9HF Solder Paste Halogen-Free, No-Clean Best-in-class response-to-pause print performance and definition with low variation Exceptional printing and reflow after room temperature storage for 30 days High oxidation resistance allowing exceptional wetting to oxidized BGA and pad surfaces Restricted flux residue Eliminates hot and cold slump

Articles in this issue

Links on this page

Archives of this issue

view archives of SMT Magazine - SMT-Aug2017