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38 DESIGN007 MAGAZINE I MARCH 2018 Failure Analysis: A Critical Component to Process Engineering E My definition of process engineering: attempt- ing to put together the perfect manufacturing stages to produce the desired product. Printed circuit production includes many diverse pro- duction stages. I-Connect007 Launches Fundamentals of RF/Microwave PCBs Micro eBook E I-Connect007 is excited to announce the release of the latest title in our micro eBook design series: The Printed Circuit Designer's Guide to… Fundamentals of RF/Microwave PCBs. All About Flex: Polyimide vs. Silicone for Flexible Heaters E Flexible heaters are sub-divided into two pri- mary technology platforms: etched-foil and wire-based technology. Wire-based (wire strands woven together or single strand wire) is the more common technology, with multiple customers offering a wide range of products. Equipment/Process Selection: Case Study of a DMADV Approach to PCB FAB Process Design E This article outlines the approach we took to designing this new phase of our commercial existence, which has now been spun off as a separate business unit known as GreenSource Fabrication. EIPC's 2018 Winter Conference in Lyon Review of Day 1 E Venue for the 2018 EIPC Winter Conference was the splendid new Alstom Transport Infor- mation Solutions facility in Villeurbanne, in the Lyon metropolitan area of the Auvergne-Rhône- Alpes region in Eastern France. The Best It's Ever Been, Every Year: The Goal for IPC, Part 1 E The end of 2017 caps an exciting time for IPC and IPC China as membership has grown sub- stantially, in part because of new offerings from the organization to its Asian members. John Mitchell and Phil Carmichael discuss IPC's focus for 2018. Solder Limits: Updates for the Age of Surface Mount E Solder limits are one of the fundamental parameters used when evaluating the PCB, sol- der resists, and metal-clad base materials for safety under the UL Recognition programme. All About Flex: Copper Thickness Requirements for Flex Circuits E An end user will specify the copper thickness of a printed circuit for different reasons. The most obvious reason would be for current- carrying capacity, but copper thickness also directly impacts thermal performance and impedance. CircuitData: Creating an Open Source Language for PCB Data Exchange E I recently spoke with Elmatica CTO Andreas Lydersen on a subject of great interest, namely CircuitData. This open source language prom- ises to greatly improve the communication of details that can be misinterpreted. Willy Wonka: The Lean Case Study E No matter where my travels take me, I hear a wide and limitless supply of excuses for why Lean will not work in "my" organization. One of my favorite ways of illustrating that Lean will indeed work anywhere is to take a Lean look at Willy Wonka's Chocolate Factory. PCB007 Highlights

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