38 DESIGN007 MAGAZINE I MARCH 2018
Failure Analysis: A Critical Component
to Process Engineering E
My definition of process engineering: attempt-
ing to put together the perfect manufacturing
stages to produce the desired product. Printed
circuit production includes many diverse pro-
duction stages.
I-Connect007 Launches Fundamentals
of RF/Microwave PCBs Micro eBook E
I-Connect007 is excited to announce the release
of the latest title in our micro eBook design
series: The Printed Circuit Designer's Guide to…
Fundamentals of RF/Microwave PCBs.
All About Flex: Polyimide vs. Silicone
for Flexible Heaters E
Flexible heaters are sub-divided into two pri-
mary technology platforms: etched-foil and
wire-based technology. Wire-based (wire
strands woven together or single strand wire)
is the more common technology, with multiple
customers offering a wide range of products.
Equipment/Process Selection:
Case Study of a DMADV Approach to
PCB FAB Process Design E
This article outlines the approach we took to
designing this new phase of our commercial
existence, which has now been spun off as a
separate business unit known as GreenSource
Fabrication.
EIPC's 2018 Winter Conference in Lyon
Review of Day 1 E
Venue for the 2018 EIPC Winter Conference
was the splendid new Alstom Transport Infor-
mation Solutions facility in Villeurbanne, in the
Lyon metropolitan area of the Auvergne-Rhône-
Alpes region in Eastern France.
The Best It's Ever Been, Every Year:
The Goal for IPC, Part 1 E
The end of 2017 caps an exciting time for IPC
and IPC China as membership has grown sub-
stantially, in part because of new offerings
from the organization to its Asian members.
John Mitchell and Phil Carmichael discuss
IPC's focus for 2018.
Solder Limits: Updates for the Age
of Surface Mount E
Solder limits are one of the fundamental
parameters used when evaluating the PCB, sol-
der resists, and metal-clad base materials for
safety under the UL Recognition programme.
All About Flex: Copper Thickness
Requirements for Flex Circuits E
An end user will specify the copper thickness
of a printed circuit for different reasons. The
most obvious reason would be for current-
carrying capacity, but copper thickness also
directly impacts thermal performance and
impedance.
CircuitData: Creating an Open Source
Language for PCB Data Exchange E
I recently spoke with Elmatica CTO Andreas
Lydersen on a subject of great interest, namely
CircuitData. This open source language prom-
ises to greatly improve the communication of
details that can be misinterpreted.
Willy Wonka: The Lean Case Study E
No matter where my travels take me, I hear a
wide and limitless supply of excuses for why
Lean will not work in "my" organization. One
of my favorite ways of illustrating that Lean
will indeed work anywhere is to take a Lean
look at Willy Wonka's Chocolate Factory.
PCB007 Highlights
