Issue link: https://iconnect007.uberflip.com/i/989774
4 SMT007 MAGAZINE I JUNE 2018 Manufacturers are having to navigate critical challenges that rock their boat when faced with assembling flexible printed circuits. The flex market continues to be one of the fastest grow- ing segments of the circuit board industry, mainly driven by the significant rise in the consumer electronics sector. In this issue, we examine these concerns and highlight some of the strategies and techniques used to address them. Flex Circuit Assembly Flex Circuit Assembly: Challenges and Strategies for Success by Stephen Las Marias Conversation with… Miraco: Strategies for Successful Flex Circuit Assembly Interview with Jason Michaud Conversation with… Vexos: Doing it Right the First Time Interview with Harry Chan Conversation with… Thermaltronics: Addressing Temperature Challenges in Flex Circuit Rework Interview with Zen Lee and Michael Gouldsmith Reflow Perspectives to Flex Circuit Assemblies by Stephen Las Marias 12 22 34 40 48 JUNE 2018 • FEATURED CONTENT 12 22 34 40