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JULY 2018 I SMT007 MAGAZINE 15 form using the underlying science and engi- neering of metallurgical interactions and taking the commonly-occurring solder joint failure mechanisms into consideration. In other words, the design was to mitigate those likely failure mechanisms so that solder joints, by serving as electrical, thermal and physical conduits in chip level, package level and on circuit board, can reliably connect powerful semiconductor chips to the outside world to make reliable advanced electronics that we all enjoy using in all facets of our lives. SMT007 References 1. Environment-friendly Electronics — Lead- free Technology," Chapter 8, Electrochemical Publications, Great Britain, ISBN-0 901 150 401. About the Author: Dr. Hwang, an inter- national businesswoman, interna- tional speaker, and business and technology advisor, is a pioneer and long-standing contributor to SMT manufacturing since its inception, as well as to the lead-free electronics implementation. Among her many awards and honors, she is inducted to the International Hall of Fame for Women in Technol- ogy, elected to the National Academy of Engineering, and named an R&D-Stars-to-Watch and YWCA Achievement Award recipient. Having held senior executive positions with Lockheed Martin Corp., Sherwin Williams Co., SCM Corp, and IEM Corp., she is currently CEO of H-Technolo- gies Group, providing business, technology and manu- facturing solutions. She serves as Chairman of Assess- ment, on the Board of DoD Army Research Laboratory, on the Commerce Department's Export Council, on the National Materials and Manufacturing Board, and on various national panels/committees, Fortune-500 NYSE companies, and civic and university boards. Hwang also holds various international leadership positions. She is the author of 500+ publications and several books, and a speaker and author on trade, business, educa- tion, and social issues. Her formal education includes four academic degrees as well as the Harvard Busi- ness School Executive Program and Columbia University Corporate Governance Program. For more information, please visit Jigar Patel Discusses ZESTRON's Reliability Solutions for Class 3 Assemblies At the recent SMTA West Penn Expo held in Monro- eville, Pennsylvania, I-Connect007 Managing Editor Patty Goldman had a chance to discuss a paper presented by Jigar Patel, senior application engineer at ZESTRON. Most of the Class 3 assemblies are used in aero- space, medical electronics, and similar areas where they need long-term reliability. These products should perform for certain time under all the conditions. Take, for example, a pacemaker. Once they put the pace- maker inside your heart, it should work for a minimum 10 years without replacing the battery. If you have any residual contamination inside the circuit board that is going inside the pacemaker, it will create leakage current. You need to ensure there is no contamination present and the battery does not drain out. This is just one example. Patel explained the reliability challenges for the Class 3 assemblies and how Zestron can help them if they're cleaning their boards. Read the full interview here.

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