nasonic
Ultra-low Transmission Loss Multi-layer Circuit Board
Materials for ICT Infrastructure Equipment
MEGTROK7
Laminate
Prepreg
Features
R-5785{N)
R-5680{N)
H-VLP2 Cu and Low Dk
Glass-Cloth Specifications
•
H-VLP2 copper foil and Low Dk glass-cloth allows for
30% loss improvement than MEGTRON 6
• Glass transition temperature ( ): 200
°
C (DSC)
• Reduce process cost (Improve drill processability and
ENIG (Electro-Nickel Immersion Gold))
Applications
Dk Of
R-5785(N)
3.4
0.002
+ H-VLP2 Cu
@ 12GHz
R-5775
3.6 0.004
@ 12GHz
• High-end servers, High-end routers, Supercomputers, and other ICT infrastructure equipment,
Antenna (Base station, Automotive millimeter-wave radar), etc.
Trasmission Loss
• Evaluation Sample
100um
I�
---150um
150um
Line Length
1000mm
Impedance
500
Copper Thickness
18 µm
Inner Cu Treatment
No-surface Treatment
Core Type
#1078 (RC67%) x 2ply
Prepreg pe
#1078 x 2ply
--
Contact us
DISTRIBUTOR IN NORTH AMERICA
MATRIX USA INC.
0
-10
-20
C
-30
"
.E
-
4
0
C
-so
0
TORONTO •SANTAANA• SANTA CLARA• CHICAGO• MIN NESOTA
Visit our website at www.matrixusa.us
-
MEG? Low-Dk glass + H-VLP2
- MEG? Low-Dk glass+ H-VLP
- MEG? Low-Dk glass + RTF
• More information
Partnering to go beyond.
