PCB007 Magazine

PCB007-July2018

Issue link: https://iconnect007.uberflip.com/i/1002143

Contents of this Issue

Navigation

Page 55 of 91

56 PCB007 MAGAZINE I JULY 2018 to a new survey conducted by the Wireless Power Consortium (WPC). PCB Design Software Market to Reach $4B by 2023 E The PCB design software market is expected to grow at a CAGR of around 26% from 2018 to 2023 to reach $4 billion by the end of the fore- cast period. Tiny Defects in Semiconductors Created 'Speed Bumps' for Electrons E UCLA scientists and engineers have developed a new process for assembling semiconduc- tor devices. The advance could lead to much more energy-efficient transistors for electron- ics and computer chips, diodes for solar cells and light-emitting diodes, and other semicon- ductor-based devices. Worldwide Semiconductor Equipment Billings in Q1 2018 Reach Record $17.0 Billion E Worldwide semiconductor manufacturing equipment billings reached a historic quarter- ly high of US$17.0 billion for the first quarter of 2018, surging 59% in March to an all-time monthly high of $7.8 billion. AT&T, BT, Orange, Singtel, and Vodafone Lead the Way for Next-Generation elecom Services in Asia/Pacific E AT&T, BT, Orange, Singtel, and Vodafone are identified as 'Leaders' of the next-generation telecom service providers in Asia/Pacific, but there are plenty of challengers in the market. NAU Scientist Contributes to Significant Advance in Silicon Photonics E Northern Arizona University assistant profes- sor Ryan Behunin collaborated with a team of physicists from Yale and the University of Tex- as at Austin in discovering an innovative way to manipulate light in silicon. 5G Networks Have a Paramount Role in Autonomous Vehicle Connectivity E 5G networks may be 10 times more efficient than 4G networks. With this new level of net- work capability, communications service pro- viders (CSPs) can secure future market oppor- tunities with manufacturers of autonomous vehicles(AVs). IEEE Releases the International Roadmap for Devices and Systems E IEEE announced the release of the 2017 edition of the International Roadmap for Devices and Systems (IRDS), projecting technology needs for evolving the semiconductor and computer industries. The Survey Said: Industry Optimistic After Strong 2017 E During recent trade shows and conferences, we spoke with a variety of fabricators and assem- bly providers. Every company achieved strong growth in 2017 and shared a positive outlook about the future. Consumer Adoption, Interest in Wireless Charging Continues to Surge, New International Survey Shows E Consumer adoption of wireless charging tech- nology has increased dramatically, according

Articles in this issue

Links on this page

Archives of this issue

view archives of PCB007 Magazine - PCB007-July2018