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LEADERSHIP IN ELECTRONICS INNOVATION 227 Freight Street, Waterbury, CT 06702 USA ©2018 MacDermid Systek THF MacuSpec VF-TH 200 Streamlining two processes into a single, easy- to-use system, the MacuSpec VF-TH 200 is the newest in advanced metallization processing. Achieve through hole metallization and via filling in the same bath, on the same boards, at the same time, in under 60 minutes with minimal copper buildup on panel surfaces. The future of thermal management in IC packaging is here. Systek THF is a two-step bridge and fill process that fills plated through holes with high quality, sturdy, and pure copper metal, allowing for never-before-seen improvements in design miniaturization and heat removal from the package. For more information: electronics.macdermidenthone.com infoelectronics@macdermidenthone.com BRIDGE FILL

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