Design007 Magazine

84 DESIGN007 MAGAZINE I JULY 2018 PCB West 2018 E September 11–13, 2018 Santa Clara, California, USA IPC E-Textiles 2018 Workshop E September 13, 2018 Des Plaines, Illinois, USA electronica India productronica India E September 26–28, 2018 Bengaluru, India electronicAsia 2018 E October 13–16, 2018 Hong Kong SMTA International E October 16–17, 2018 Rosemont, Illinois, USA TPCA Show 2018 E October 24–26, 2018 Taipei, Taiwan electronica 2018 E November 13–16, 2018 Munich, Germany HKPCA/IPC International Printed Circuit & South China Fair E December 5–7, 2018 Shenzhen, China 48 th NEPCON JAPAN E January 16–18, 2019 Tokyo Big Sight, Japan IPC APEX EXPO Conference and Exhibition E January 26–31, 2019 San Diego, California, USA DesignCon 2019 E January 29–31, 2019 Santa Clara, California, USA Events Calendar Additional Event Calendars

• Design007 Magazine July 2018
• Featured Content — PCB Designers: The Next Generation
• Additional Content
• Column — Who Are the Next-Gen Designers?
• Feature — Susy Webb: Training the New Generation of Designers
• Short — Smart Bandages Designed to Monitor, Tailor, Treat Chronic Wounds
• Feature — Help Wanted: PCB Design Layout Specialist
• Feature — Mentor Preparing for Next-Gen PCB Designers
• Feature Column — Where Have All the Designers Gone (and Who Will Be Taking Their Place)?
• Feature — In With the New at Cadence
• Short — Opening Up a Pathway to Cost-effective, Autonomous IoT Application
• PCB007 Highlights
• Column — Crosstalk Margins
• Short — The Future of Electronics is Chemical
• Column — Are Solvent-Free, Water-Based Coatings Reliable?
• Short — A Step Closer to Single-Atom Data Storage
• MilAero007 Highlights
• Article — Advanced Stackup Planning with Impedance, Delay and Loss Validation
• Short — NASA, Partners, Advance In-Space Assembly Robotics
• Top 10 Recent Highlights from Design007
• Career Opportunities Section
• Events Calendar
• Advertiser Index and Masthead
• I-Connect007 Subscriptions and contact info.