FLEX007

JULY 2018 I FLEX007 MAGAZINE 1 Diving into Flex Quarterly | July 2018

• Flex007: Diving into Flex
• Featured Content — Diving Into Flex
• Additional Content
• Column — Diving into Flexible Circuits
• Feature — Bose Ready to Take Flex into the Future
• Feature — Excerpt: The Printed Circuit Designer's Guide to…Flex and Rigid-Flex Fundamemtals — Designing Flex Circuits for First-Pass Success, Part 2
• Feature — For Cadwell, Flex is the Right Prescription
• Short — Flex Survey: Design Issues
• Feature — Managing the Challenges of Flex and Rigid-Flex Design
• Feature Interview — Prototron Stretches into the Flex Arena
• Column — How Flex Can Help Circuits Keep a Low Profile
• Short — The Future of Electronics is Chemical
• Column — Acrylic Vs. Epoxy Adhesives for Flexible Circuits
• Short — A Step Closer to Single-Atom Data Storage
• Column — When is Rigid-Flex the Best Solution?
• Column — The Learning Curve: Your First Flex Circuit
• Short — NASA, Partners, Advance In-Space Assembly Robotics
• Column — Flex Circuits: More Than Just a PCB
• Short — The Pros and Cons of Artificial Intelligence
• Flex007 Highlights
• Events Calendar
• Advertiser Index and Masthead
• Back Cover