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Universal Finish SolderBond is an ENEPIG process using pure palladium. It is already being used in the aerospace, aeronautic, satellite, mobile and automotive industries. The process provides excellent reliability for solder joints. Thanks to its extremely wide bonding process window it is the best choice for wire bond applications. Universal Finish SolderBond also guarantees the best corrosion protection. Black pad failure, for instance, is completely eliminated. Qualified for aerospace and satellite technology www.atotech.com Global head office Atotech Group Rick Nichols +49 30 34985 340 Rick.nichols@ atotech.com Universal Finish SolderBond ENEPIG fi nish for soldering, gold, aluminum and copper-wire bonding Soldering Gold-wire wedge 100 µm Aluminum-wire wedge

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