Issue link: https://iconnect007.uberflip.com/i/1011746
42 PCB007 MAGAZINE I AUGUST 2018 • D-33a committee for Performance specifications (IPC-6012) • D-22 committee for Performance specification (IPC-6018) These new efforts will address the early de- tection of microvia defects using the new cou- pons, resistance monitoring during reflow (or simulations) and thermal stress/thermal shock. This includes the PCQRR Program and IPC-6012 QML Program, where entirely new parametric panel artwork has been created to include HDI staggered and stacked microvias and complex constructions up to 24-layers. Coupon Description Purpose Use AB/R General purpose AB coupon for through features Plated hole/via evaluation, feature size and spacing, annular ring, thermal stress and rework simulation Lot Conformance A/R General purpose A coupon for use when B features are not present Plated hole evaluation, feature size and spacing, annular ring, thermal stress and rework simulation Lot Conformance H Surface insulation resistance coupon Surface insulation resistance When Specified P Peel strength coupon Peel strength/Plating adhesion Periodic/Lot Conformance S Hole solderability coupon Hole solderability Lot Conformance E Moisture and insulation resistance coupon Moisture and insulation resistance, Dielectric Withstanding Voltage Periodic Conformance G Solder mask coupon Solder mask adhesion Lot Conformance W Surface mount solderability coupon Surface mount solderability, finish plating thickness verification by XRF Lot Conformance Z Controlled impedance coupon Controlled impedance When Specified D General purpose AB daisy-chain via coupon Plated hole/via reliability When Specified Propagated D D coupon for non-through (propagated) via features Plated structure reliability When Specified Propagated B B coupon for non-through (propagated) via features Plated hole evaluation, annular ring and thermal stress Lot Conformance Table 3: IPC-2221, Appendix A Coupon Table. Figure 1: D coupon layout. (Source: IPC-2221 Appendix A)